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ILC7010/7011
80mA SC70 Low Noise CMOS RF-LDOTM Regulator
Features
* * * * * * * * 1% output voltage accuracy Low noise Only 75A ground current at 80mA load Ripple rejection up to 75dB at 1kHz Excellent line and load transient response Guaranteed to 80mA output current Industry standard five lead SC70 packages Fixed 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.3V and custom output voltage options
General Description
The ILC7010/7011 is an 80mA, Ultra Low Noise, Low Dropout (LDO) linear regulator, designed and processed in CMOS technology. This process combines the best CMOS features of low quiescent current, small size and low dropout voltage with the best bipolar features of high ripple rejection, ultra low noise and power handling capability. The ILC7010/ 7011 offers a quiescent current of less than 100A, a logic level enable (regulator EN) pin, a footprint that is half the size of the industry standard SOT-23, and a low dropout voltage of 25mV at 10mA. With better than 70 dB (1kHz) of ripple rejection, low noise of 40V RMS and 1% output voltage accuracy, the ILC7010/7011 sets a new standard in linear regulators for communications and personal electronics applications.
Applications
* * * * Cellular phones Wireless communicators PDAs / palmtops / organizers Battery powered portable electronics
Block Diagram
VIN
Error Amplifier Voltage Reference
Transconductance Amplifier
CN (ILC7011 only)
+ VOUT -
EN
Thermal Shut Down GND
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ILC7010/7011
PRODUCT SPECIFICATION
Test circuit
VIN VIN CIN EN GND (CN) CN VOUT COUT RL
Figure 1.
Pin Configuration
VIN
5
VOUT
4
CN
5
EN
4
ILC7010
1 2 3 1
ILC7011
2 3
EN N/C GND SC70
VOUT GND VIN
Pin Definition ILC7010
Pin Number 1 2 3 4 5 Pin Name EN N/C GND VOUT VIN Pin Function Description Enable input. High level enables VOUT while Low level commands shutdown mode and discharge COUT to GND Not connected Ground of the IC Voltage output. Regulated output voltage Supply voltage input
Pin Definition ILC7011
Pin Number 1 2 3 4 5 Pin Name VOUT GND VIN EN CN Ground of the IC Supply voltage input Enable input. High level enables VOUT while Low level commands shutdown mode and discharge COUT to GND Optional noise bypass capacitor Pin Function Description Voltage output. Regulated output voltage
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ILC7010/7011
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Parameter Supply Voltage EN Input Voltage Output Voltage Junction Temperature (TJ) Storage Temperature Lead Soldering Temperature, 10 seconds Power Dissipation (PD) -40 -0.3 -0.3 Min. Max. 10 VIN + 0.3 VIN + 0.3 150, Internally limited 150 300 150 Units V V V C C C mW
Recommended Operating Conditions
Parameter Supply Voltage VDD Peak Output Current Ambient Operating Temperature Conditions VIN to GND IOUT to GND, tpw=2mS TA -40 Min. VOUT+VDO Typ. VOUT+1 Max. VOUT+4 120 85 Units V mA C
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ILC7010/7011
PRODUCT SPECIFICATION
Electrical Specifications
VIN=VOUT+1V, IOUT=1mA, VEN=2V and TA = +25C using circuit in Figure 1 with CIN=COUT=1F, CN=0, unless otherwise specified Parameter Output Voltage Ground pin Current Line Regulation Load Regulation Dropout Voltage1,2 Symbol VOUT IGND VOUT/VOUT/ VIN VOUT/VOUT VDO IOUT=10mA IOUT=80mA VIN: VOUT+1V to VOUT+2V IOUT=1 to 80mA IOUT=10mA, VOUT>2.8V IOUT=20mA, VOUT>2.8V IOUT=80mA, VOUT>2.8V Shutdown (OFF) current EN Input Voltage EN Input Current Output Noise Voltage ILC7011 Ripple Rejection Dynamic Line Regulation Dynamic Load Regulation Resistance Discharge in OFF state IOFF VEN IEN eN VEN=0 High = ON state Low = OFF state VEN=0.6V VEN=2V BW=300Hz to 50kHz CIN=COUT=2.2uF, CN=10nF IOUT=10mA COUT=4.7uF, 120Hz IOUT=80mA VIN=1V,IOUT=80mA, tr/tf=2uS IOUT=80mA, tr<5mS VEN=0 2 0.6 0.3 1 40 V RMS dB mV mV k A Conditions Min. 0.99 VOUTnom Typ. VOUTnom 70 90 0.017 0.12 25 50 220 10 Max. 1.01 VOUTnom 90 110 0.075 0.2 30 60 250 40 nA V %/V % mV Units V A
PSRR VOUT (line) VOUT (load) RDISC
65 10 15 1.5
Notes: 1. For 2.5V < VOUT < 2.8V refer to diagram "Dropout Voltage vs. Output Voltage." 2. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal value measured with 1V differential.
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ILC7010/7011
Typical Applications Diagrams
Thermal Protection VIN = VOUTnom+1V Output to GND, IOUT=0.5A/div Load Transient Response VIN = VOUT+1V, CN=0 IOUT=80mA
VOUT(AC)
IOUT (0.1A/div)
Line Transient Response VIN = VOUT+1V to VOUT+2V Load=10mA, COUT=2.2F
ON/OFF Transient Response Load=80mA, COUT=1F, CN=0
VIN
VEN
VOUT(AC) VOUT
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ILC7010/7011
PRODUCT SPECIFICATION
ON/OFF Transient Response Load=10mA, COUT=1F CN=10nF(ILC7011)
ON/OFF Transient Response Load=10mA, COUT=1F, CN=0
VEN
VEN
VOUT
VOUT
Ground Current
120 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 80mA Load
Ground Current (A)
No Load
5
6
7
8
Input Voltage (V)
Output Voltage
2.830 2.825 2.820 2.815 2.810 2.805 -40 -20 0 20 40 60 80 300 1mA Load
Dropout Voltage
Dropout Voltage (mV)
Output Voltage (V)
250 200 150 100 50 0 0 20 40 60 80 100 -40C 25C 85C
80mA Load
Temperature (C)
Load Current (mA)
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PRODUCT SPECIFICATION
ILC7010/7011
Ripple Rejection Load=10mA, COUT=4.7F
Ripple Rejection Load=80mA, COUT=4.7F
Dropout Voltage vs. Output Voltage
400 350 300 250 200 150 100 50 0
Maxium VDO (mV)
80mA load
10mA load 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5
VOUT (V)
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ILC7010/7011
PRODUCT SPECIFICATION
Application Information
Capacitor Selection
In general ceramic capacitors are preferred due to their superior ESR performance.Those with X5R dielectric offer the best temperature coefficient. An input capacitor of 1F or greater, connected between Input and Ground, located in close proximity to the device will improve the transient response and the noise rejection. An output capacitor of at least 1F is required to maintain regulator loop stability. Stable operation will be achieved with a wide variety of capacitors with ESR ranging from 10m to 10. An optional capacitor connected between the CN pin and ground can significantly reduce noise on the output.Values ranging from 470pF to 10nF can be used, depending upon the sensitivity to output noise in the application. Care should be taken to prevent noise from external sources to enter into the CN pin, which is a very sensitive, high impedance pin. Leakage currents into this pin will directly affect the regulator accuracy and should be kept as low as possible.
Thermal Characteristics
ILC7010/7011 is designed to supply up to 80mA at the specified output voltage with an operating die (junction) temperature of up to 125 C. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SC70 surface-mount package and the surrounding PC Board copper to which it is mounted. The relationship describing the thermal behavior of the package is:
T J ( max ) - T A P D ( max ) = ------------------------------- JA
where TJ(max) is the maximum junction temperature of the die, which is 125 C, and TA is the ambient operating temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SC70 package is specified at 224 C /W, the JA of the minimum PWB footprint will be at least 235 C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PCB. Depending on the size of the copper area, the resulting JA can range from approximately 180 C /W for one square inch, to nearly 130 C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. Once the limiting parameters in the thermal relationship have been determined, the electrical design should be verified to ensure that the device remains within specified operating conditions. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition.
Control Functions Enable Pin
Applying a voltage of 0.6V or less at the Enable pin will disable the output, reducing the quiescent output current to less than 1A, while a voltage of 2V or greater will enable the device. If this shutdown function is not needed,the pin can simply be connected to the VIN pin. Allowing this pin to float will cause erratic operation.
Thermal Protection
The ILC7010/7011 is designed to supply high peak output currents for brief periods, however this output load will cause the device temperature to increase and exceed maximum ratings due to power dissipation.During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 125 C, onboard thermal protection will disable the output until the temperature drops below this limit, at which point the output is then re-enabled. During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level.
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PRODUCT SPECIFICATION
ILC7010/7011
General PCB Layout Considerations
To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the high frequency compensation components (input, bypass, and output capacitors)should be located as close to the device as possible.
The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation significantly increases the temperature of the device. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside.
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ILC7010/7011
PRODUCT SPECIFICATION
Mechanical Dimensions
5 Lead SC70
0.65
-A-
2.000.20 0.65
.5 min
5
4
-B- 1.250.10
1.9 2.100.10
1
2
3 0.4 min LAND PATTERN RECOMMENDATION SEE DETAIL A
0.25
+0.10 0.20 -0.05
max 0.1 M
0.9.10
0.95.15
0.25 0.10
0.10 0.00
max 0.1
6.00 R0.14 GAGE PLANE R0.10 0-30 6.00 0.45 0.10 0.425 NOMINAL DETAIL A
0.20
NOTES: A. CONFORMS TO EIAJ REGISTERED OUTLINE DRAWING SC88A. B. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. C. DIMENSIONS ARE IN MILLIMETERS.
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ILC7010/7011
PRODUCT SPECIFICATION
Ordering Information
Output Voltage 2.5 2.6 2.7 2.8 2.85 2.9 3.0 3.1 3.3 Part Number ILC7010AIC525X ILC7010AIC526X ILC7010AIC527X ILC7010AIC528X ILC7010AIC5285X ILC7010AIC529X ILC7010AIC530X ILC7010AIC531X ILC7010AIC533X Temperature Range -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C Package SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70
Output Voltage 2.5 2.6 2.7 2.8 2.85 2.9 3.0 3.1 3.3
Part Number ILC7011AIC525X ILC7011AIC526X ILC7011AIC527X ILC7011AIC528X ILC7011AIC5285X ILC7011AIC529X ILC7011AIC530X ILC7011AIC531X ILC7011AIC533X
Temperature Range -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C -40 to 85 C
Package SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
www.fairchildsemi.com 3/21/02 0.0m 002 Stock#DS30007010 2002 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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